Shenzhen Xinhuo Future Technology Co., Ltd.

Shenzhen Xinhuo Future Technology Co., Ltd.

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XCVM1802-1LLIVSVA2197

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Province/State:guangdong
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XCVM1802-1LLIVSVA2197

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Category :Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status :Active
Peripherals :DDR, DMA, PCIe
Primary Attributes :Versal™ Prime FPGA, 1.9M Logic Cells
Series :Versal™ Prime
Package :Tray
Mfr :AMD
Supplier Device Package :2197-FCBGA (45x45)
Connectivity :CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :-40°C ~ 100°C (TJ)
Architecture :MPU, FPGA
Package / Case :2197-BFBGA, FCBGA
Number of I/O :770
RAM Size :256KB
Speed :400MHz, 1GHz
Core Processor :Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size :-
Description :IC VERSAL AICORE FPGA 2197BGA
Stock :In Stock
Shipping Method :LCL, AIR, Express
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.9M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)
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